Specification

The ThermaCool family of high performance thermally conductive gap fillers provides solutions to difficult thermal management applications. These products can be used to fill gaps and enhance thermal performance of the electrical system.

ThermaCool gap fillers can accommodate materials of different coefficients of thermal expansion with the compliant interface. The ThermaCool gap filler family includes products in a variety of thicknesses and a range of hardness values to effectively close gaps while providing the thermal transfer needed in demanding electronic applications.