Saint-Gobain High Performance Seals made its debut for SEMICON CHINA 2019

2019-03-25

SEMICON CHINA 2019 was held in Shanghai on 20-22 March which attracted the world's leading technology companies which design, develop, manufacture or supply the technologies to manufacture the microelectronics that drive today's most sophisticated consumer and industrial electronic products.

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Saint-Gobain Seals team exhibited their innovative seals solutions for semiconductor industry for this time. Meldin®-HIGH-PERFORMANCE THERMOSET POLYIMIDE MATERIALS and OmniSeal®-SPRING-ENERGIZED SEALS which meet the needs of high purity, high resistance to solvents, oils and other process chemicals, and high electrical insulative properties, attracted a lot of professional visitors.

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Also, our FURON, VERSILON products, including high purify valves, pumps, connection parts which provide safe and efficient chemical transmission, received many onsite inquires.